The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 2023
Filed:
Oct. 02, 2018
Ddp Specialty Electronic Materials Us, Llc, Wilmington, DE (US);
Tyler Auvil, Auburn Hills, MI (US);
Gary L. Jialanella, Oxford, MI (US);
Eric E. Cole, Auburn Hills, MI (US);
Felix Koch, Freienbach, CH;
Andreas Lutz, Freienbach, CH;
Daniel Schneider, Freienbach, CH;
DDP SPECIALTY ELECTRONIC MATERIALS US, LLC, Wilmington, DE (US);
Abstract
An epoxy-based crash durable adhesive composition including: (I) a liquid resin system comprising: (a) at least one epoxy resin; and (b) at least one toughener; wherein the viscosity of the above liquid resin system is less than about 800 Pa s at a temperature of 15° C.; and wherein the viscosity of the above liquid resin system is greater than about 5 Pa-s at a temperature of 60° C.; (II) a solid material comprising: (c) at least one hydrophobic fumed silica, wherein the fumed silica is present in the adhesive composition at a concentration of greater than 5 weight percent; and (III) a curative material comprising: (d) at least one latent heat-activated curing agent; wherein the rheology of the epoxy-based crash durable adhesive composition is such that the adhesive composition is pumpable at a temperature of 15° C. or greater; and wherein the epoxy-based crash durable adhesive composition exhibits an increase in wash-off resistance; a process for making the above adhesive composition; and a process for bonding metal substrates together with the above adhesive composition.