The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 2023
Filed:
Nov. 10, 2021
Elite Electronic Material (Zhongshan) Co., Ltd., Zhongshan, CN;
Teng Xu, Zhongshan, CN;
Zhilong Hu, Zhongshan, CN;
Xiangnan Li, Zhongshan, CN;
Shuwen Liu, Zhongshan, CN;
Cheng Li, Zhongshan, CN;
ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO., LTD., Zhongshan, CN;
Abstract
A resin composition includes 100 parts by weight of a prepolymer and 100 parts by weight to 250 parts by weight of a spherical silica prepared by vaporized metal combustion, wherein: the prepolymer is prepared by subjecting a reaction mixture to a prepolymerization reaction; the reaction mixture includes a maleimide resin, an amino-modified silicone and cyclohexanone, and relative to a total of 100 parts by weight of the maleimide resin, the amino-modified silicone and the cyclohexanone, the reaction mixture includes 60 parts by weight to 80 parts by weight of the maleimide resin, 15 parts by weight to 30 parts by weight of the amino-modified silicone and 2 parts by weight to 15 parts by weight of the cyclohexanone; the reaction mixture does not include m-aminophenol or p-aminophenol; and the amino-modified silicone has an amino equivalent of 750 g/mol to 2500 g/mol. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including varnish transparency, varnish sedimentation property, glass transition temperature, X-axis coefficient of thermal expansion, T300 thermal resistance, resin cluster and resin filling property.