The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 2023
Filed:
Jul. 06, 2022
Hyundai Motor Company, Seoul, KR;
Kia Corporation, Seoul, KR;
Dae Ha Co., Ltd., Dangjin-si, KR;
Jin Young Yoon, Gimpo-si, KR;
Hee Joon Lee, Seoul, KR;
Dong Eun Cha, Hwaseong-si, KR;
Sun Jun Kwon, Seoul, KR;
Chun Ho Park, Seoul, KR;
Seung Ryong Jeong, Seoul, KR;
Kwan Suk Ryu, Suwon-si, KR;
Tae Kyung Lee, Incheon, KR;
Abstract
The present disclosure provides a thermoplastic resin composition having high rigidity and a low coefficient of linear thermal expansion and a molded article including the same. Specifically, the thermoplastic resin composition includes a first polypropylene resin having crystallinity of 50% to 80%, a second polypropylene resin having a coefficient of linear thermal expansion of 70 μm/m·° C. to 90 μm/m·° C., an elastomer, and an inorganic filler.