The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 21, 2023

Filed:

Jul. 06, 2021
Applicant:

Seyang Polymer, Incheon, KR;

Inventors:

Hyuk Jin Kim, Jincheon-gun, KR;

Tae-Young Ha, Incheon, KR;

Sun Hwa Jang, Yongin-si, KR;

Youn Eung Lee, Daejeon, KR;

Jin Kyu Lee, Hwaseong-si, KR;

Assignee:

SEYANG POLYMER, Incheon, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 63/60 (2006.01); C08G 63/81 (2006.01); C08K 7/28 (2006.01); C08K 3/40 (2006.01); C08K 3/34 (2006.01); C08K 13/04 (2006.01);
U.S. Cl.
CPC ...
C08G 63/605 (2013.01); C08G 63/81 (2013.01); C08K 3/34 (2013.01); C08K 3/40 (2013.01); C08K 7/28 (2013.01); C08K 13/04 (2013.01); C08G 2250/00 (2013.01); C08K 2003/343 (2013.01); C08K 2201/014 (2013.01);
Abstract

The present disclosure relates to a liquid crystal polyester resin composition comprising a liquid crystal polyester resin with a low dielectric constant and a low dielectric loss containing a naphthoic acid monomer as a main skeleton and a hydroxybenzoic acid; a glass bubble having a pressure resistance of 12,000 psi or more; and an inorganic filler such as mica. The present disclosure provides a liquid crystal polyester resin composition suitable for 5G communication materials, which can achieve low dielectric loss characteristics, and at the same time, the addition of glass bubbles with excellent pressure resistance can achieve a low dielectric constant and a low dielectric loss through the maintenance of the hollow body of the glass bubbles even after melt extrusion.


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