The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 2023
Filed:
Mar. 30, 2020
Applicant:
Amazon Technologies, Inc., Seattle, WA (US);
Inventors:
William Scott Kalm, Seattle, WA (US);
Kushal Patel, Seattle, WA (US);
Assignee:
Amazon Technologies, Inc., Seattle, WA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B65G 39/18 (2006.01); B65G 9/00 (2006.01); B26D 7/32 (2006.01); B26D 7/01 (2006.01); B65H 35/00 (2006.01); B65B 31/06 (2006.01); B65H 29/58 (2006.01);
U.S. Cl.
CPC ...
B65G 39/18 (2013.01); B26D 7/018 (2013.01); B26D 7/32 (2013.01); B65B 31/06 (2013.01); B65G 9/002 (2013.01); B65H 29/58 (2013.01); B65H 35/0086 (2013.01); B65G 2203/0233 (2013.01); B65G 2203/042 (2013.01);
Abstract
A packaging sizer can receive and segment packaging into two or more segments. The packaging sizer can receive the packaging on a conveyance surface and convey the packaging to a position for segmenting. A segmenting assembly can segment the packaging to form two or more segments. The resulting segments can be directed in different directions for different purposes. For example, one or more of the segments can be removed from the packaging sizer and one or more segments can be moved to a position for manipulation by a packaging manipulator.