The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 21, 2023

Filed:

Dec. 28, 2018
Applicant:

Gold Industries Co., Ltd., Osaka, JP;

Inventors:

Toshimitsu Hazama, Miyazaki, JP;

Taisei Murata, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B65D 73/02 (2006.01); B32B 7/025 (2019.01); B32B 27/18 (2006.01); B32B 27/30 (2006.01); B65D 65/40 (2006.01); C08K 3/04 (2006.01); C08L 25/06 (2006.01); C08L 25/10 (2006.01); C08L 51/04 (2006.01);
U.S. Cl.
CPC ...
B65D 73/02 (2013.01); B32B 7/025 (2019.01); B32B 27/18 (2013.01); B32B 27/30 (2013.01); B65D 65/40 (2013.01); C08K 3/04 (2013.01); C08L 25/06 (2013.01); C08L 25/10 (2013.01); C08L 51/04 (2013.01);
Abstract

An object of the present invention is to provide a conductive sheet and an embossed carrier tape that can reduce detachment of carbon black and prevents deterioration of buckling strength. A conductive sheet for an embossed carrier tape for mounting an electronic component, in which the conductive sheet has a configuration in which a surface layer having conductivity is laminated on at least one surface of a core layer; the core layer and the surface layer each contain a common material constituted of only a combination of three types of polystyrene-based resins of styrene-butadiene copolymer resin, general purpose polystyrene resin, and high impact polystyrene resin; a common material constituting the core layer and a common material constituting the surface layer have the same compounding ratio; and the surface layer is formed by kneading carbon black in the common material.


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