The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 21, 2023

Filed:

Mar. 27, 2019
Applicant:

Dai Nippon Toryo Co., Ltd., Osaka, JP;

Inventors:

Yasuhiro Anzai, Tochigi, JP;

Naoyuki Masuda, Tochigi, JP;

Akira Suetsugu, Tochigi, JP;

Shinya Sakaguchi, Aichi, JP;

Mami Saito, Tochigi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41M 5/52 (2006.01); B41J 2/01 (2006.01); C09D 11/101 (2014.01); C09D 11/36 (2014.01); C09D 11/54 (2014.01); C09D 11/30 (2014.01); B32B 27/00 (2006.01); C09D 5/00 (2006.01);
U.S. Cl.
CPC ...
B41M 5/5209 (2013.01); B32B 27/00 (2013.01); B41J 2/01 (2013.01); B41M 5/52 (2013.01); C09D 5/00 (2013.01); C09D 11/101 (2013.01); C09D 11/30 (2013.01); C09D 11/36 (2013.01); C09D 11/54 (2013.01); B41M 5/5218 (2013.01); B41M 5/5227 (2013.01); B41M 5/5254 (2013.01);
Abstract

Disclosed is a printed object which, even if using a receptive layer that is difficult for a monomer in an active energy ray curable ink to penetrate, has excellent adhesion between the active energy ray curable ink and the receptive layer, and in which the amount of unreacted monomer dissipated from the printed object is low. This printed object includes an ink receptive layer laminated on a substrate surface and having an ink absorption rate of 100% or less, and an ink layer laminated on a surface of the ink receptive layer and made from an active energy ray curable ink which includes a polymerizable compound, wherein the glass transition temperature of the polymerizable compound is −45-25° C.


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