The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 2023
Filed:
Nov. 11, 2020
Applicants:
Rolls-royce Corporation, Indianapolis, IN (US);
Rolls-royce North American Technologies, Inc., Indianapolis, IN (US);
Inventors:
Quinlan Yee Shuck, Indianapolis, IN (US);
Scott Nelson, Carmel, IN (US);
Raymond Ruiwen Xu, Carmel, IN (US);
Brandon David Ribic, Noblesville, IN (US);
Matthew R. Gold, Carmel, IN (US);
Assignees:
Rolls-Royce Corporation, Indianapolis, IN (US);
Rolls-Royce North American Technologies, Inc., Indianapolis, IN (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 64/118 (2017.01); B29C 64/295 (2017.01); B29C 64/205 (2017.01); B29C 64/245 (2017.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); B29L 31/18 (2006.01); B33Y 30/00 (2015.01); B33Y 80/00 (2015.01); B29K 103/06 (2006.01); B29K 29/00 (2006.01); B29K 25/00 (2006.01); B29K 55/02 (2006.01); B29K 67/00 (2006.01); B29L 31/08 (2006.01);
U.S. Cl.
CPC ...
B29C 64/118 (2017.08); B29C 64/205 (2017.08); B29C 64/245 (2017.08); B29C 64/295 (2017.08); B33Y 70/00 (2014.12); B29K 2025/06 (2013.01); B29K 2029/04 (2013.01); B29K 2055/02 (2013.01); B29K 2067/046 (2013.01); B29K 2103/06 (2013.01); B29L 2031/082 (2013.01); B29L 2031/18 (2013.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 80/00 (2014.12);
Abstract
An additive manufacturing technique includes depositing, via a filament delivery device, a filament onto a surface of a substrate. The filament includes a binder and a high entropy alloy powder. The technique also includes sacrificing the binder to form a preform and sintering the preform to form a component.