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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11819915 B1

PDFFull Text
Date of Patent:
Nov. 21, 2023

Filed:

Oct. 18, 2017

Bonding member and bonding method

Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventor:

Seitaro Washizuka, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Nagaokakyo, JP;

Attorney:

ArentFox Schiff LLP

Primary Examiner:

Nicholas A Wang

Int. Cl.
CPC ...
B22F 1/00 (2006.01); B23K 20/00 (2006.01); B23K 35/26 (2006.01); C22C 13/00 (2006.01); B23K 1/20 (2006.01); B23K 35/30 (2006.01); B23K 20/16 (2006.01); B22F 7/06 (2006.01); B23K 1/19 (2006.01); C22C 9/05 (2006.01); B23K 35/02 (2006.01); C22C 13/02 (2006.01); C22C 9/06 (2006.01); B23K 1/00 (2006.01); B23K 20/02 (2006.01); H05K 3/34 (2006.01); C22C 9/00 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
B22F 1/09 (2022.01); B22F 7/064 (2013.01); B23K 1/0002 (2013.01); B23K 1/0016 (2013.01); B23K 1/19 (2013.01); B23K 1/20 (2013.01); B23K 20/00 (2013.01); B23K 20/026 (2013.01); B23K 20/16 (2013.01); B23K 35/025 (2013.01); B23K 35/0222 (2013.01); B23K 35/0244 (2013.01); B23K 35/26 (2013.01); B23K 35/262 (2013.01); B23K 35/30 (2013.01); B23K 35/302 (2013.01); C22C 9/00 (2013.01); C22C 9/05 (2013.01); C22C 9/06 (2013.01); C22C 13/00 (2013.01); C22C 13/02 (2013.01); H05K 3/34 (2013.01); H05K 3/3457 (2013.01); B22F 2998/10 (2013.01); B22F 2999/00 (2013.01); B23K 2101/42 (2018.08); H05K 2203/0425 (2013.01);
Abstract

A bonding member that includes a resin body defining an airtight interior, and a bonding material enclosed in the interior of the resin body. The bonding material is a mixed powder that includes a plurality of particles of a first metal powder and a plurality of particles of a second metal powder. The second metal powder reacts with the first metal powder when melted to thereby produce an intermetallic compound. The resin body has a melting point higher than a softening point of the mixed powder.

Find Patent Forward Citations

Washizuka, Seitaro. (2023). Bonding member and bonding method (U.S. Patent No. 11819915). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11819915

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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