The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 2023
Filed:
Mar. 24, 2021
Applicant:
Dowa Electronics Materials Co., Ltd., Tokyo, JP;
Inventor:
Masanori Fujii, Tokyo, JP;
Assignee:
DOWA ELECTRONICS MATERIALS CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/22 (2006.01); C03C 4/14 (2006.01); B22F 1/08 (2022.01); B22F 1/16 (2022.01); B22F 1/103 (2022.01); B22F 1/107 (2022.01); B22F 1/17 (2022.01); B22F 9/24 (2006.01); C03C 8/16 (2006.01); C03C 8/18 (2006.01); B22F 1/05 (2022.01);
U.S. Cl.
CPC ...
B22F 1/08 (2022.01); B22F 1/103 (2022.01); B22F 1/107 (2022.01); B22F 1/16 (2022.01); B22F 1/17 (2022.01); B22F 9/24 (2013.01); C03C 4/14 (2013.01); C03C 8/16 (2013.01); C03C 8/18 (2013.01); H01B 1/22 (2013.01); B22F 1/05 (2022.01); B22F 2301/255 (2013.01); B22F 2302/25 (2013.01); B22F 2304/10 (2013.01);
Abstract
A silver powder containing: silver particles; and an adherent that is attached to surfaces of the silver particles and contains a metal oxide that has a melting point lower than a melting point of silver.