The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 21, 2023

Filed:

Jul. 19, 2017
Applicant:

Compagnie Generale Des Etablissements Michelin, Clermont-Ferrand, FR;

Inventors:

Milan Fedurco, Clermont-Ferrand, FR;

Antonio Delfino, Clermont-Ferrand, FR;

David Olsommer, Clermont-Ferrand, FR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 4/02 (2006.01); B05D 1/02 (2006.01); C09D 7/20 (2018.01); C09D 5/24 (2006.01); C09D 127/16 (2006.01); C09D 163/10 (2006.01); H01M 8/0206 (2016.01); H01M 8/0221 (2016.01); H01M 8/0228 (2016.01); C08K 3/04 (2006.01); H01M 8/10 (2016.01);
U.S. Cl.
CPC ...
B05D 1/02 (2013.01); C09D 5/24 (2013.01); C09D 7/20 (2018.01); C09D 127/16 (2013.01); C09D 163/10 (2013.01); H01M 8/0206 (2013.01); H01M 8/0221 (2013.01); H01M 8/0228 (2013.01); B05D 2202/15 (2013.01); B05D 2504/00 (2013.01); B05D 2506/10 (2013.01); C08K 3/042 (2017.05); C08K 2201/001 (2013.01); C08K 2201/005 (2013.01); H01M 2008/1095 (2013.01);
Abstract

A process for depositing a metal-adhesive, hydrophobic and electrically conductive coating based on electrically conductive microparticles and on a polymer matrix P comprising at least one thermoplastic fluoropolymer P1 and a thermosetting resin P2, comprises: in a first container, dissolve the polymer P1 in an organic solvent; in a second container, disperse the electrically conductive microparticles in an organic solvent; add, in the first container, the thermosetting resin P2 in the liquid state; mix the contents of the containers, then deposit the mixture on the substrate; crosslink the resin P2 and remove the solvents, to obtain a first coating; then impregnate the surface of the substrate with an additional resin solution P2 dissolved in a third solvent, which is a solvent of the resin P2 and a non-solvent of the polymer P1; eliminate the third solvent and crosslink while compressing the additional resin P2 in order to obtain the targeted final coating.


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