The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 14, 2023

Filed:

Jun. 02, 2022
Applicant:

Fortemedia, Inc., Santa Clara, CA (US);

Inventors:

Li-Jen Chen, Hsinchu, TW;

Yu-Xuan Xu, Hsinchu, TW;

Yu-Ting Cheng, Hsinchu, TW;

Shih-Chin Gong, Taipei, TW;

Assignee:

FORTEMEDIA, INC., Alviso, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 9/06 (2006.01); B81C 1/00 (2006.01); H04R 7/04 (2006.01); H04R 7/16 (2006.01); H04R 1/02 (2006.01); H04R 31/00 (2006.01); H04R 9/04 (2006.01); H04R 9/02 (2006.01);
U.S. Cl.
CPC ...
H04R 9/06 (2013.01); B81C 1/00587 (2013.01); H04R 1/025 (2013.01); H04R 7/04 (2013.01); H04R 7/16 (2013.01); H04R 9/025 (2013.01); H04R 9/047 (2013.01); H04R 31/003 (2013.01); H04R 31/006 (2013.01); B81C 2201/014 (2013.01); B81C 2201/0132 (2013.01); B81C 2201/0133 (2013.01); H04R 2307/025 (2013.01);
Abstract

A package structure of a micro speaker is provided. The package structure includes a substrate, a diaphragm, a coil, an etch stop layer, a carrier board, a permanent magnetic element, and package lid. The substrate has a hollow chamber. The diaphragm is suspended over the hollow chamber. The coil is embedded in the diaphragm. The etch stop layer is positioned below the coil and overlaps the coil in the direction that is perpendicular to the top surface of the diaphragm. The etch stop layer is made of a metal material. The carrier board is disposed on the bottom surface of the substrate. The permanent magnetic element is disposed on the carrier board and in the hollow chamber. The package lid is wrapped around the substrate and the diaphragm, and has a lid opening that exposes a portion of the top surface of the diaphragm.


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