The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 14, 2023

Filed:

Mar. 02, 2022
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventor:

Moo Young Kim, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04N 25/75 (2023.01); H04N 25/79 (2023.01); H01L 27/146 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H04N 25/75 (2023.01); H04N 25/79 (2023.01); H01L 24/08 (2013.01); H01L 27/1463 (2013.01); H01L 27/14621 (2013.01); H01L 27/14627 (2013.01); H01L 27/14634 (2013.01); H01L 27/14636 (2013.01); H01L 27/14645 (2013.01); H01L 2224/08145 (2013.01);
Abstract

An image sensor includes first and second column lines, and a read circuit configured to receive pixel signals through the first and second column lines. The first column line and the second column line each include a main wire, a first wire between one end of the main wire and the first interlayer connection region, and a second wire connected with an opposite end of the main wire. A first distance between the first and second column lines is longer than a second distance between a connection point of the first column line and the first interlayer connection region and a connection point of the second column line and the first interlayer connection region. A length of the first wire of the first column line is greater than a length of the first wire of the second column line.


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