The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 14, 2023
Filed:
Mar. 15, 2019
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Inventor:
Yasuaki Shin, Nagaokakyo, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03H 9/02 (2006.01); H03H 9/10 (2006.01); H01L 25/18 (2023.01); H03H 9/05 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H03H 9/02897 (2013.01); H01L 24/13 (2013.01); H01L 25/18 (2013.01); H03H 9/1085 (2013.01); H01L 25/0655 (2013.01); H01L 25/50 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/81205 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/15313 (2013.01); H01L 2924/35121 (2013.01); H03H 9/059 (2013.01); H03H 9/0542 (2013.01);
Abstract
An electronic component includes a package substrate extending in a longitudinal direction, and chip components disposed along the longitudinal direction of the package substrate and each connected to the package substrate by a bump. A height of a bump connecting at least one chip component disposed at an end portion in the longitudinal direction among the chip components and the package substrate is greater than a height of a bump connecting at least one chip component disposed inward relative to the end portion in the longitudinal direction among the chip components and the package substrate.