The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 14, 2023
Filed:
May. 19, 2022
Applicant:
Stanley Electric Co., Ltd., Tokyo, JP;
Inventors:
Assignee:
STANLEY ELECTRIC CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); B32B 7/12 (2006.01); B32B 15/08 (2006.01); B32B 15/20 (2006.01); B32B 27/28 (2006.01); F21V 19/00 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); B32B 7/12 (2013.01); B32B 15/08 (2013.01); B32B 15/20 (2013.01); B32B 27/281 (2013.01); F21V 19/0015 (2013.01); B32B 2250/02 (2013.01); B32B 2255/06 (2013.01); B32B 2255/26 (2013.01); B32B 2255/28 (2013.01); B32B 2307/306 (2013.01); B32B 2307/412 (2013.01); B32B 2307/7246 (2013.01); B32B 2457/08 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/81815 (2013.01); H01L 2933/0066 (2013.01);
Abstract
A laminated film in which a heat-resistant base film and a metal foil are bonded using an adhesive is provided with a barrier layer that prevents chemicals from entering the adhesive layer, between the metal foil and the adhesive layer. The barrier layer is made of a heat-resistant resin similar to that of the base film and has a water absorption rate of 1% or less. The adhesive layer is a silicone-based resin and has a thickness of 40 μm or more after drying.