The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 14, 2023
Filed:
Sep. 22, 2021
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Sung Dae Suk, Watervliet, NY (US);
Somnath Ghosh, Clifton Park, NY (US);
Chen Zhang, Guilderland, NY (US);
Junli Wang, Slingerlands, NY (US);
Devendra K. Sadana, Pleasantville, NY (US);
Dechao Guo, Niskayuna, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 25/07 (2006.01); H01L 29/08 (2006.01);
U.S. Cl.
CPC ...
H01L 29/785 (2013.01); H01L 25/074 (2013.01); H01L 29/0847 (2013.01); H01L 29/7827 (2013.01);
Abstract
A semiconductor device fabrication method is provided. The semiconductor device fabrication method includes frontside semiconductor device processing on a frontside of a wafer, flipping the wafer, backside semiconductor device processing on a backside of the wafer and backside and frontside contact formation processing on the backside and frontside of the wafer, respectively.