The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 14, 2023
Filed:
Mar. 02, 2022
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Inventors:
Kenichi Hamanaka, Nagaokakyo, JP;
Kota Zenzai, Nagaokakyo, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/232 (2006.01); H01B 1/22 (2006.01); C22C 9/06 (2006.01); B22F 1/103 (2022.01); B22F 1/17 (2022.01); H01G 4/30 (2006.01);
U.S. Cl.
CPC ...
H01G 4/2325 (2013.01); B22F 1/103 (2022.01); B22F 1/17 (2022.01); C22C 9/06 (2013.01); H01B 1/22 (2013.01); B22F 2304/10 (2013.01); H01G 4/30 (2013.01);
Abstract
A conductive paste includes a conductive metal powder and a curable resin. The conductive metal powder includes Ag, Cu, and Ni. In the conductive metal powder, a mass ratio of Ag is about 3.0 wt % or more and about 10.0 wt % or less, a mass ratio of Cu is about {(1−mass ratio of Ag/100)×70} wt % or more and about {(1−mass ratio of Ag/100)×95} wt % or less, and a mass ratio of Ni is about {(1−mass ratio of Ag/100)×5} wt % or more and about {(1−mass ratio of Ag/100)×30} wt % or less.