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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11817245 B1

PDFFull Text
Date of Patent:
Nov. 14, 2023

Filed:

Jan. 29, 2018

Soft magnetic powder

Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventors:

Toru Takahashi, Nagaokakyo, JP;

Kazuhiro Henmi, Nagaokakyo, JP;

Noriharu Yodoshi, Sendai, JP;

Akihiro Makino, Sendai, JP;

Assignee:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Attorney:

Studebaker & Brackett PC

Primary Examiner:

Xiaowei Su

Int. Cl.
CPC ...
B22F 1/00 (2022.01); B22F 9/08 (2006.01); B22F 5/00 (2006.01); H01F 1/147 (2006.01); H01F 27/255 (2006.01); H01F 27/28 (2006.01); H01F 1/153 (2006.01); H01F 17/04 (2006.01); C22C 45/02 (2006.01); B22F 1/05 (2022.01); B22F 1/08 (2022.01); C22C 38/00 (2006.01); C22C 38/02 (2006.01); C22C 38/08 (2006.01); C22C 38/10 (2006.01); C22C 38/16 (2006.01); H02K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01F 17/04 (2013.01); B22F 1/05 (2022.01); B22F 1/08 (2022.01); B22F 5/00 (2013.01); B22F 9/082 (2013.01); C22C 38/002 (2013.01); C22C 38/02 (2013.01); C22C 38/08 (2013.01); C22C 38/10 (2013.01); C22C 38/16 (2013.01); C22C 45/02 (2013.01); H01F 1/14741 (2013.01); H01F 1/15308 (2013.01); H01F 1/15375 (2013.01); H01F 27/255 (2013.01); H01F 27/28 (2013.01); B22F 2005/004 (2013.01); B22F 2009/0824 (2013.01); B22F 2301/35 (2013.01); B22F 2304/10 (2013.01); B22F 2998/10 (2013.01); B22F 2999/00 (2013.01); C22C 2200/02 (2013.01); C22C 2202/02 (2013.01); H02K 1/02 (2013.01);
Abstract

A soft magnetic powder according to the present disclosure comprises a particle having no hollow part as a main component, wherein a number of hollow particle present in a region of 2.5 mm square is 40 or less in a cross section of a molded body obtained by powder-compacting and molding the soft magnetic powder so as to have a volume filling rate of 75% or more and 77% or less (i.e., from 75% to 77%).

Find Patent Forward Citations

Takahashi, Toru. (2023). Soft magnetic powder (U.S. Patent No. 11817245). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11817245

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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