The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 14, 2023

Filed:

Dec. 05, 2022
Applicant:

Shenzhen Goodix Technology Co., Ltd., Guangdong, CN;

Inventors:

Pan Gao, Guangdong, CN;

Baoquan Wu, Guangdong, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06V 40/13 (2022.01); H04N 25/20 (2023.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
G06V 40/1318 (2022.01); H01L 27/14621 (2013.01); H01L 27/14623 (2013.01); H01L 27/14627 (2013.01); H01L 27/14678 (2013.01); H01L 27/14685 (2013.01); H04N 25/20 (2023.01);
Abstract

Embodiments of the present application disclose a fingerprint identification apparatus and an electronic device, which can simplify an optical path laminated structure and processing process, thereby improving efficiency of mass production. The fingerprint identification apparatus includes: a fingerprint sensor chip; an infrared radiation cut filter layer provided above the fingerprint sensor chip; a light blocking layer provided on an upper surface of the infrared radiation cut filter layer by means of coating film, the light blocking layer being provided with a first hole array, and cross sections of holes in the first hole array being inverse trapezoid; a light transmitting dielectric layer including first color filter units, the first color filter units being formed in part of the holes in the first hole array to cover the part of the holes; and a microlens array provided above the light transmitting dielectric layer.


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