The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 14, 2023
Filed:
Sep. 07, 2022
Semiconductor Components Industries, Llc, Phoenix, AZ (US);
James Joseph Victory, Trabuco Canyon, CA (US);
Klaus Neumaier, Erding, DE;
YunPeng Xiao, Shanghai, CN;
Jonathan Harper, Munich, DE;
Vaclav Valenta, Brno, CZ;
Stanley Benczkowski, Bear Creek Township, PA (US);
Thierry Bordignon, Toulouse, FR;
Wai Lun Chu, Kowloon, HK;
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US);
Abstract
Implementations of a method of designing a module semiconductor product may include receiving a selection of a module type, one or more die, a placement of one or more wires, clips, or pins; and generating, using a processor, a module configuration file. The method may include generating a module bonding diagram using a build diagram system module; selecting one or more SPICE models corresponding with the die; and generating a product SPICE model and a three dimensional model for the module semiconductor product. The method may include generating one or more datasheet characteristics of the module semiconductor product with at least the product SPICE model and the product simulation module, generating a product datasheet for the module semiconductor product using the datasheet formation module, and providing access to at least the module bonding diagram, the product SPICE model, the three dimensional model, and the product datasheet to the user.