The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 14, 2023

Filed:

Jan. 21, 2021
Applicant:

Dongwoo Fine-chem Co., Ltd., Jeollabuk-do, KR;

Inventors:

Jong Min Kim, Gyeonggi-do, KR;

Han Sub Ryu, Gyeongsangbuk-do, KR;

Dong Pil Park, Incheon, KR;

Assignee:

DONGWOO FINE-CHEM CO., LTD., Jeollabuk-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/16 (2006.01); G06F 1/18 (2006.01); H01Q 1/38 (2006.01); H01Q 1/36 (2006.01); H01Q 1/22 (2006.01); H01Q 9/04 (2006.01); H01Q 1/46 (2006.01);
U.S. Cl.
CPC ...
G06F 1/1698 (2013.01); G06F 1/1626 (2013.01); G06F 1/189 (2013.01); H01Q 1/22 (2013.01); H01Q 1/364 (2013.01); H01Q 1/38 (2013.01); H01Q 1/46 (2013.01); H01Q 9/045 (2013.01); H01Q 9/0485 (2013.01);
Abstract

An antenna structure of an embodiment of the present invention includes a film antenna including a dielectric layer and an antenna electrode layer formed on an upper surface of the dielectric layer, and a flexible circuit board including a power supply wiring electrically connected to the antenna electrode layer. A bonding region is defined by a region in which the antenna electrode layer and the power supply wiring are overlapped with each other in a planar direction, and the bonding region has a length of 1.5 mm or less. Signal efficiency and radiation reliability may be improved by adjusting a length of the bonding region.


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