The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 14, 2023
Filed:
Oct. 08, 2019
Applicant:
Fraunhofer-gesellschaft Zur Förderung Der Angewandten Forschung E.v., Munich, DE;
Inventors:
Norman Laske, Bokelrehm, DE;
Hans-Joachim Quenzer, Itzehoe, DE;
Vanessa Stenchly, Meldorf, DE;
Amit Kulkarni, Hamburg, DE;
Arne Veit Schulz-Walsemann, Oldenborstel, DE;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29D 11/00 (2006.01); H01L 31/0232 (2014.01); H01L 31/18 (2006.01); G02B 3/00 (2006.01);
U.S. Cl.
CPC ...
G02B 3/0025 (2013.01); B29D 11/00298 (2013.01); H01L 31/02327 (2013.01); H01L 31/186 (2013.01);
Abstract
A production method includes fixing ball elements of a semiconductor material to a carrier substrate by means of heat and pressure; and one-sided thinning of the ball elements fixed to the carrier substrate to form plano-convex lens elements of a semiconductor material.
Laske, Norman. (2023). Method for producing lens elements and packaged radiation-sensitive devices on wafer level (U.S. Patent No. 11815699). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11815699
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile