The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 14, 2023
Filed:
Aug. 14, 2020
Tianjie Lei, Beijing, CN;
Tianjie Lei, Beijing, CN;
Yazhen Zhang, Beijing, CN;
Xiaoxuan Xu, Beijing, CN;
Chao Li, Beijing, CN;
Qiang Li, Beijing, CN;
Li Zhang, Beijing, CN;
Adu Gong, Beijing, CN;
Kaiyang Ding, Beijing, CN;
Weiwei Wang, Beijing, CN;
Jinhong Wan, Beijing, CN;
Huaidong Zhao, Beijing, CN;
Haoyu Yang, Beijing, CN;
Other;
Abstract
The present disclosure provides a method and a system for precise location of a high slope collapse area. Firstly, the slope images in a long time series are obtained, the slope images in the long time series are composed into a two-dimensional slope deformation graph, and an area with the maximum deformation in the two-dimensional slope deformation graph is selected as a deformation area. Then, the deformation area is segmented by straight line, and the deformation region obtained by straight line segmentation is displayed in overlapping way in the slope images of long time series, and the region corresponding to the connecting line with the largest change range is selected as the monitoring line area from the overlapping image. Finally, the monitoring points are selected from the monitoring line area to determine the location of the high slope collapse area.