The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 14, 2023

Filed:

Sep. 27, 2021
Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Jun Abe, Takasaki, JP;

Koji Kato, Takasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C30B 29/30 (2006.01); C30B 15/00 (2006.01);
U.S. Cl.
CPC ...
C30B 29/30 (2013.01); C30B 15/00 (2013.01);
Abstract

Provided is a method for producing a lithium tantalate single crystal substrate capable of suppressing increase in volume resistivity of the lithium tantalate single crystal substrate owing to reduction failure even when a lithium carbonate power is repeatedly used in heat treatment for the lithium tantalate single crystal substrate. The invention is a method for producing a lithium tantalate single crystal substrate having a volume resistivity of 1×10Ω·cm or more and less than 1×10Ω·cm, including a step of heat-treating a lithium tantalate single crystal substrate having a volume resistivity of 1×10Ω·cm or more and having a single-domain structure, under normal pressure and at a temperature of 350° C. or higher but not higher than the Curie temperature thereof while burying it in a lithium carbonate powder having a BET specific surface area of 0.13 m/g or more, wherein the lithium carbonate powder is a used lithium carbonate powder that has been used in burying a lithium tantalate single crystal substrate in heat treatment for the lithium tantalate single crystal structure under normal pressure and at a temperature of 350° C. or higher but not higher than the Curie temperature thereof, and in the heat treatment step, the heat treatment is carried out in a mixed gas atmosphere of an inert gas and a reducing gas at the start of the heat treatment, and after the heat treatment in the mixed gas atmosphere, the heat treatment is carried out in a single gas atmosphere of an inert gas.


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