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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11814732 B1

PDFFull Text
Date of Patent:
Nov. 14, 2023

Filed:

Sep. 07, 2021

Hot-dip plated steel

Applicant:

Nippon Steel Corporation, Tokyo, JP;

Inventors:

Takuya Mitsunobu, Tokyo, JP;

Mamoru Saito, Tokyo, JP;

Kohei Tokuda, Tokyo, JP;

Hiroshi Takebayashi, Tokyo, JP;

Assignee:

Nippon Steel Corporation, Tokyo, JP;

Attorney:

Renner, Otto, Boisselle & Sklar, LLP

Primary Examiner:

Michael E La Villa

Int. Cl.
CPC ...
C23C 2/06 (2006.01); C23C 2/28 (2006.01); C22C 18/04 (2006.01); B32B 15/01 (2006.01); B32B 15/04 (2006.01); B32B 15/18 (2006.01); C22C 18/00 (2006.01); C23C 2/26 (2006.01); C23C 28/02 (2006.01); C23C 28/00 (2006.01); C23C 30/00 (2006.01); C21D 1/26 (2006.01); C21D 8/02 (2006.01); C21D 9/46 (2006.01);
U.S. Cl.
CPC ...
C23C 2/06 (2013.01); B32B 15/013 (2013.01); B32B 15/016 (2013.01); B32B 15/04 (2013.01); B32B 15/043 (2013.01); B32B 15/18 (2013.01); C21D 1/26 (2013.01); C21D 8/0278 (2013.01); C21D 9/46 (2013.01); C22C 18/00 (2013.01); C22C 18/04 (2013.01); C23C 2/26 (2013.01); C23C 2/28 (2013.01); C23C 2/29 (2022.08); C23C 28/025 (2013.01); C23C 28/3225 (2013.01); C23C 30/00 (2013.01); C23C 30/005 (2013.01); Y10T 428/12792 (2015.01); Y10T 428/12799 (2015.01); Y10T 428/12972 (2015.01); Y10T 428/26 (2015.01);
Abstract

A hot-dip plated steel includes a base steel and a hot-dip plating layer on a surface of the base steel, a chemical composition of the hot-dip plating layer contains, by mass %, Al: 10.00% to 30.00%, Mg: 3.00% to 12.00%, Sn: 0% to 2.00%, Si: 0% to 2.50%, Ca: 0% to 3.00%, Ni: 0% or more and less than 0.25%, Fe: 0% to 5.00%, and the like, a remainder includes Zn and impurities, a metallographic structure of the hot-dip plating layer contains 5 to 45 area % of an α phase having a grain diameter of 0.5 to 2 μm, the metallographic structure of the hot-dip plating layer contains 15 to 70 area % of a MgZnphase, and, among the α phases having the grain diameter of 0.5 to 2 μm, an area ratio of an α phase having a (111)α//(0001)MgZnorientation relationship to the adjacent MgZnphase is 25% to 100%.

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