The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 14, 2023
Filed:
Aug. 27, 2021
Applicant:
Shin-etsu Polymer Co., Ltd., Tokyo, JP;
Inventor:
Sou Matsubayashi, Kitaadachi-gun, JP;
Assignee:
Shin-Etsu Polymer Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09D 5/24 (2006.01); H01B 1/12 (2006.01); C08K 5/3492 (2006.01); C09D 7/63 (2018.01); C08G 61/12 (2006.01); C08L 65/00 (2006.01); H01B 13/00 (2006.01); C08L 101/12 (2006.01); C08K 5/3477 (2006.01); C09D 7/20 (2018.01); C09D 165/00 (2006.01); C09D 167/00 (2006.01); C09D 175/12 (2006.01);
U.S. Cl.
CPC ...
C09D 5/24 (2013.01); C08G 61/126 (2013.01); C08K 5/3477 (2013.01); C08K 5/34924 (2013.01); C08L 65/00 (2013.01); C08L 101/12 (2013.01); C09D 7/20 (2018.01); C09D 7/63 (2018.01); C09D 165/00 (2013.01); C09D 167/00 (2013.01); C09D 175/12 (2013.01); H01B 1/12 (2013.01); H01B 1/124 (2013.01); H01B 13/00 (2013.01); H01B 13/0036 (2013.01); C08G 2261/135 (2013.01); C08G 2261/3223 (2013.01); C08G 2261/51 (2013.01); C08G 2261/59 (2013.01); C08G 2261/64 (2013.01); C08G 2261/72 (2013.01); C08G 2261/76 (2013.01);
Abstract
A conductive polymer dispersion of this disclosure includes: a conductive composite containing a π-conjugated conductive polymer and a polyanion; an isocyanurate-based compound; and a dispersion medium for dispersing the conductive composite.