The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 14, 2023

Filed:

Jul. 31, 2019
Applicant:

Ube Corporation, Ube, JP;

Inventors:

Tetsuya Yasui, Ube, JP;

Atsushi Yamashita, Ube, JP;

Assignee:

UBE CORPORATION, Ube, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 77/02 (2006.01); B29C 48/00 (2019.01); B29C 48/05 (2019.01); B29K 77/00 (2006.01); B29K 105/00 (2006.01);
U.S. Cl.
CPC ...
C08L 77/02 (2013.01); B29C 48/022 (2019.02); B29C 48/05 (2019.02); B29K 2077/00 (2013.01); B29K 2105/0026 (2013.01); C08L 2201/08 (2013.01); C08L 2205/025 (2013.01); C08L 2205/035 (2013.01);
Abstract

A polyamide resin composition is provided which can be blow molded while concurrently satisfying blow moldability and uniform wall thickness of the molten resin, exhibits excellent thermal stability when the resin composition is accumulated as a melt and thereby gives molded articles with a good surface appearance, and is further excellent in impact resistance at room and low temperatures. The polyamide resin composition includes, based on 100 mass % of the polyamide resin composition, 40 to 84 mass % of a polyamide resin (A), not less than 15 mass % of an olefin-based ionomer (B), 0 to 10 mass % of an impact modifier (C), and 0.1 to 3 mass % of heat resistant agents (D). The polyamide resin (A) includes at least one selected from the group consisting of aliphatic copolyamides (A-1) and aromatic copolyamides (A-2). The heat resistant agents (D) include two or more kinds of organic hindered phenol heat resistant agents (D-1).


Find Patent Forward Citations

Loading…