The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 14, 2023

Filed:

Mar. 04, 2021
Applicant:

Carbon, Inc., Redwood City, CA (US);

Inventors:

Julia D. Cushen, San Francisco, CA (US);

James Goodrich, Downington, PA (US);

Jason P. Rolland, San Carlos, CA (US);

Assignee:

Carbon, Inc., Redwood City, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08G 59/68 (2006.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); B29C 64/124 (2017.01); B29C 64/35 (2017.01); B33Y 40/20 (2020.01); B29C 71/04 (2006.01); C08J 5/00 (2006.01); C08L 63/00 (2006.01); B29K 63/00 (2006.01); B29K 105/00 (2006.01); B29K 421/00 (2006.01); B33Y 70/10 (2020.01);
U.S. Cl.
CPC ...
C08G 59/68 (2013.01); B29C 64/124 (2017.08); B29C 64/35 (2017.08); B29C 71/04 (2013.01); B33Y 10/00 (2014.12); B33Y 40/20 (2020.01); B33Y 70/00 (2014.12); C08J 5/00 (2013.01); C08L 63/00 (2013.01); B29K 2063/00 (2013.01); B29K 2105/0002 (2013.01); B29K 2421/00 (2013.01); B29K 2995/0077 (2013.01); B29K 2995/0089 (2013.01); B33Y 70/10 (2020.01); C08J 2363/00 (2013.01); C08J 2433/08 (2013.01); C08L 2205/03 (2013.01); C08L 2205/05 (2013.01);
Abstract

An epoxy dual cure resin useful for additive manufacturing of three-dimensional objects includes: (i) a photoinitiator; (ii) monomers and/or prepolymers that are polymerizable by exposure to actinic radiation or light; (iii) optionally, a light absorbing pigment or dye; (iv) an epoxy resin; (v) optionally, but in some embodiments preferably, an organic hardener co-polymerizable with the epoxy resin; (vi) optionally but preferably a dual reactive compound having substituted thereon a first reactive group reactive with said monomers and/or prepolymers that are polymerizable by exposure to actinic radiation or light, and a second reactive group reactive with said epoxy resin (e.g., an epoxy acrylate); (vii) optionally a diluent; (viii) optionally a filler; and (ix) optionally, a co-monomer and/or a co-prepolymer. Methods of using the same in additive manufacturing are also described.


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