The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 14, 2023
Filed:
Jul. 13, 2020
Applicant:
Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;
Inventors:
Kazuki Kouno, Kanagawa, JP;
Ryoma Hashimoto, Kanagawa, JP;
Assignee:
MITSUBISHI GAS CHEMICAL COMPANY, INC., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 59/28 (2006.01); B32B 1/00 (2006.01); B32B 7/12 (2006.01); B32B 27/08 (2006.01); B32B 27/32 (2006.01); B32B 27/36 (2006.01); B65D 65/40 (2006.01); B65D 65/42 (2006.01); C08G 59/50 (2006.01); C08J 5/18 (2006.01);
U.S. Cl.
CPC ...
C08G 59/28 (2013.01); B32B 1/00 (2013.01); B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 27/32 (2013.01); B32B 27/36 (2013.01); B65D 65/40 (2013.01); B65D 65/42 (2013.01); C08G 59/5033 (2013.01); C08J 5/18 (2013.01); B32B 2250/02 (2013.01); B32B 2250/24 (2013.01); B32B 2255/10 (2013.01); B32B 2255/20 (2013.01); B32B 2255/26 (2013.01); B32B 2255/28 (2013.01); B32B 2307/7244 (2013.01); B32B 2307/732 (2013.01); B32B 2307/748 (2013.01); B32B 2439/46 (2013.01); B32B 2439/70 (2013.01); C08J 2363/00 (2013.01);
Abstract
Provided is a gas barrier packaging material including a base and a cured resin layer, the base having a surface constituted of an inorganic substance. The cured resin layer is a cured product of an epoxy resin composition including an epoxy resin, an epoxy resin curing agent containing an amine-based curing agent, and an acidic compound, and a ratio (basic nitrogen/acid groups) of a molar equivalent of basic nitrogen in the epoxy resin composition to a molar equivalent of acid groups derived from the acidic compound is from 0.60 to 20.