The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 14, 2023

Filed:

Jun. 25, 2020
Applicant:

Kuraray Co., Ltd., Okayama, JP;

Inventors:

Kenji Suzuki, Niigata, JP;

Yuki Nishijima, Niigata, JP;

Daiki Noguchi, Niigata, JP;

Takashi Fukumoto, Niigata, JP;

Assignee:

KURARAY CO., LTD., Okayama, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F 2/46 (2006.01); C08F 2/50 (2006.01); C08G 61/04 (2006.01); C08F 20/40 (2006.01); B33Y 70/00 (2020.01); A61C 7/08 (2006.01); A61C 13/01 (2006.01); A61F 5/56 (2006.01); C07C 69/54 (2006.01); C08K 3/36 (2006.01); B33Y 10/00 (2015.01); B29C 64/124 (2017.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
C08F 20/40 (2013.01); A61C 7/08 (2013.01); A61C 13/01 (2013.01); A61F 5/566 (2013.01); B33Y 70/00 (2014.12); C07C 69/54 (2013.01); C08K 3/36 (2013.01); B29C 64/124 (2017.08); B29L 2031/753 (2013.01); B33Y 10/00 (2014.12);
Abstract

To provide a curable composition that is readily modeled with low viscosity and excellent curing capability in modeling by stereolithography, and provides a cured article excellent in toughness and water resistance, and a resin composition for stereolithography prepared therefrom. To provide a resin composition for stereolithography that is favorable particularly for a dental mouthpiece and a denture base material. A curable composition containing 79.0 to 99.0% by mass of a polymerizable monomer (a), 0.1 to 10.0% by mass of a photopolymerization initiator (b), and 0.01 to 20.0% by mass of a compound (c) represented by the following general formula (I):


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