The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 14, 2023

Filed:

Aug. 10, 2022
Applicant:

Sakuu Corporation, San Jose, CA (US);

Inventors:

Morteza Vatani, Los Gatos, CA (US);

Philip Eugene Rogren, Half Moon Bay, CA (US);

Assignee:

Sakuu Corporation, San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 64/165 (2017.01); B29C 64/245 (2017.01); B29C 64/255 (2017.01); B29C 64/343 (2017.01); B29C 64/218 (2017.01); B29C 64/209 (2017.01); B29C 64/268 (2017.01); B29C 64/295 (2017.01); B29C 64/232 (2017.01); B29C 64/386 (2017.01); B29C 64/188 (2017.01); B29C 64/379 (2017.01); B29C 64/35 (2017.01); B22F 12/84 (2021.01); B22F 12/86 (2021.01); B33Y 50/00 (2015.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B22F 12/55 (2021.01); B22F 12/57 (2021.01);
U.S. Cl.
CPC ...
B29C 64/165 (2017.08); B22F 12/84 (2021.01); B22F 12/86 (2021.01); B29C 64/188 (2017.08); B29C 64/209 (2017.08); B29C 64/218 (2017.08); B29C 64/232 (2017.08); B29C 64/245 (2017.08); B29C 64/255 (2017.08); B29C 64/268 (2017.08); B29C 64/295 (2017.08); B29C 64/343 (2017.08); B29C 64/35 (2017.08); B29C 64/379 (2017.08); B29C 64/386 (2017.08); B22F 12/55 (2021.01); B22F 12/57 (2021.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/00 (2014.12);
Abstract

A three-dimensional, additive manufacturing system is disclosed. The first and second printer modules form sequences of first patterned single-layer objects and second patterned single-layer objects on the first and second carrier substrates, respectively. The patterned single-layer objects are assembled into a three-dimensional object on the assembly plate of the assembly station. A controller controls the sequences and patterns of the patterned single-layer objects formed at the printer modules, and a sequence of assembly of the first patterned single-layer objects and the second patterned single-layer objects into the three-dimensional object on the assembly plate. The first transfer module transfers the first patterned single-layer objects from the first carrier substrate to the assembly apparatus in a first transfer zone and the second transfer module transfers the second patterned single-layer objects from the second carrier substrate to the assembly apparatus in a second transfer zone. The first and second printer modules are configured to deposit first and second materials under first and second deposition conditions, respectively. The first and second materials are different and/or the first and second deposition conditions are different.


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