The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 07, 2023

Filed:

Feb. 23, 2021
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Eun Jung Kim, Gyeonggi-do, KR;

Hye Won Kim, Hwaseong-si, KR;

Sung Yeon Ryu, Chuncheon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10B 12/00 (2023.01);
U.S. Cl.
CPC ...
H10B 12/315 (2023.02); H10B 12/0335 (2023.02); H10B 12/053 (2023.02); H10B 12/09 (2023.02); H10B 12/34 (2023.02); H10B 12/50 (2023.02);
Abstract

A semiconductor device includes a plurality of first conductive patterns extending parallel in a first direction on a substrate, a plurality of second conductive patterns extending parallel in a second direction crossing the first direction on the substrate, a plurality of buried contacts connected to the substrate between the plurality of first conductive patterns and between the plurality of second conductive patterns, and a landing pad connected to each of the buried contacts on the plurality of buried contacts. The landing pad includes a first side surface extending in the first direction in plan view and a second side surface extending in a third direction in plan view. The third direction is different from the first direction and the second direction in plan view.


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