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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11812563 B1

PDFFull Text
Date of Patent:
Nov. 07, 2023

Filed:

Apr. 11, 2022

Method for assembling a camera for a vision system of a vehicle

Applicant:

Magna Electronics Inc., Auburn Hills, MI (US);

Inventor:

Jens Steigerwald, Sailauf-Eichenberg, DE;

Assignee:

MAGNA ELECTRONICS INC., Auburn Hills, MI (US);

Attorney:

HONIGMAN LLP

Primary Examiner:

Thiem D Phan

Int. Cl.
CPC ...
H05K 3/34 (2006.01); H05K 3/00 (2006.01); H04N 23/51 (2023.01); H04N 23/54 (2023.01); H04N 23/55 (2023.01); H05K 3/30 (2006.01); B60R 1/04 (2006.01); B60R 1/12 (2006.01); B60R 16/023 (2006.01); H01R 9/05 (2006.01); H01R 43/02 (2006.01); H04N 7/10 (2006.01); H04N 7/18 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 3/341 (2013.01); B60R 1/04 (2013.01); B60R 1/12 (2013.01); B60R 16/023 (2013.01); H01R 9/0515 (2013.01); H01R 43/0256 (2013.01); H04N 7/10 (2013.01); H04N 7/181 (2013.01); H04N 23/51 (2023.01); H04N 23/54 (2023.01); H04N 23/55 (2023.01); H05K 1/111 (2013.01); H05K 1/181 (2013.01); H05K 3/0008 (2013.01); H05K 3/303 (2013.01); B60R 2001/1253 (2013.01); B60R 2300/105 (2013.01); B60Y 2410/10 (2013.01); B60Y 2410/115 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10189 (2013.01); H05K 2203/166 (2013.01); Y02P 70/50 (2015.11); Y10T 29/49117 (2015.01); Y10T 29/49124 (2015.01); Y10T 29/53174 (2015.01);
Abstract

A method for assembling a camera suitable for use for a vision system of a vehicle includes providing a circuit board having first and second sides separated by a thickness dimension of the circuit board. An imager is disposed at the first side of the circuit board and solder pads are disposed at the second side of the circuit board. The solder pads are in electrical connection with circuitry of the circuit board. A coaxial connector is aligned at the solder pads at the second side of the circuit board. The coaxial connector is soldered at the second side of the circuit board via melting the solder paste at the solder pads.

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