The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 07, 2023
Filed:
May. 10, 2021
Sumitomo Electric Printed Circuits, Inc., Koka, JP;
Sumitomo Electric Industries, Ltd., Osaka, JP;
Koji Nitta, Osaka, JP;
Takafumi Uemiya, Osaka, JP;
Suguru Yamagishi, Osaka, JP;
Shigeki Shimada, Osaka, JP;
Hiroshi Ueda, Osaka, JP;
Satoshi Kiya, Koka, JP;
SUMITOMO ELECTRIC PRINTED CIRCUITS, INC., Koka, JP;
SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka, JP;
Abstract
A high-frequency circuit includes a first dielectric layer, a circuit layer, a second dielectric layer arranged in this order, the circuit layer includes a transmission line of a high-frequency signal and a ground pattern disposed around the transmission line. An electromagnetic wave shield is disposed in the first dielectric layer and the second dielectric layer around the transmission line. The electromagnetic wave shield includes a first ground electric conductor formed on an inner surface of at least one first hole formed to extend through the first dielectric layer without extending through the ground pattern, and a second ground electric conductor formed on an inner surface of at least one second hole formed to extend through the second dielectric layer without extending through the ground pattern. The first ground electric conductor and the second ground electric conductor are each electrically connected to the ground pattern.