The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 07, 2023

Filed:

Jun. 03, 2022
Applicant:

Rohm Co., Ltd., Kyoto, JP;

Inventors:

Kazuisao Tsuruda, Kyoto, JP;

Hideaki Yanagida, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03B 7/08 (2006.01); H01L 23/14 (2006.01); H01L 23/28 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 23/66 (2006.01); H01P 1/20 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2023.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H03B 7/08 (2013.01); H01L 23/14 (2013.01); H01L 23/28 (2013.01); H01L 23/3135 (2013.01); H01L 23/49811 (2013.01); H01L 23/49827 (2013.01); H01L 23/5389 (2013.01); H01L 23/66 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 24/97 (2013.01); H01L 25/0655 (2013.01); H01L 25/50 (2013.01); H01P 1/2005 (2013.01); H01L 2221/68345 (2013.01); H01L 2224/13111 (2013.01); H03B 2200/0084 (2013.01);
Abstract

Terahertz device includes first resin layer, columnar conductor, wiring layer, terahertz element, second resin layer, and external electrode. Resin layer includes first resin layer obverse face and first resin layer reverse face. Columnar conductor includes first conductor obverse face and first conductor reverse face, penetrating first resin layer in z-direction. Wiring layer spans between first resin layer obverse face and first conductor obverse face. Terahertz element includes element obverse face and element reverse face, and converts between terahertz wave and electric energy. Second resin layer includes second resin layer obverse face and second resin layer reverse face, and covers wiring layer and terahertz element. External electrode, disposed offset in a direction first resin layer reverse face faces with respect to first resin layer, is electrically connected to columnar conductor. Terahertz element is conductively bonded to wiring layer.


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