The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 07, 2023

Filed:

May. 25, 2022
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventor:

Shinya Aoki, Minowa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03B 5/32 (2006.01); H01L 25/16 (2023.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H03B 5/32 (2013.01); H01L 23/5383 (2013.01); H01L 25/165 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/16227 (2013.01);
Abstract

An electronic component package includes a lid, a first layer, a second layer disposed between the first layer and the lid and configuring a first frame, a third layer disposed between the second layer and the lid and configuring a second frame, a bonding member bonding the third layer to the lid, and a via wire electrically coupled to the lid and penetrating the second frame, in which, when an inner diameter of a first corner portion of the first frame is denoted by R1 and an inner diameter of a second corner portion of the second frame overlapping the first corner portion in a plan view is denoted by R2, R1<R2, and an inner surface of the second corner portion protrudes more than an inner surface of the first corner portion in a cross-sectional view.


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