The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 07, 2023

Filed:

Sep. 07, 2022
Applicant:

Nichia Corporation, Anan, JP;

Inventors:

Tatsuya Kanazawa, Anan, JP;

Kazuma Kozuru, Tokushima, JP;

Assignee:

NICHIA CORPORATION, Anan, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/00 (2006.01); H01S 5/02234 (2021.01); H01S 5/02253 (2021.01); H01S 5/02257 (2021.01); H01S 5/0236 (2021.01); H01S 5/40 (2006.01); H01S 5/02255 (2021.01);
U.S. Cl.
CPC ...
H01S 5/02234 (2021.01); H01S 5/0236 (2021.01); H01S 5/02253 (2021.01); H01S 5/02257 (2021.01); H01S 5/02255 (2021.01); H01S 5/4031 (2013.01);
Abstract

A light-emitting device includes: a plurality of semiconductor laser elements; a package having a hermetically sealed space, with the plurality of semiconductor laser elements arranged in the space; an optical member fixed to the package; and a plurality of adhesives including a first adhesive and a second adhesive fixing the optical member to the package. The plurality of adhesives are bonded to the optical member between an emission surface of the package and an incidence surface or a lower surface of the optical member. In the optical member, one or more first bonding regions to which the first adhesive is bonded and one or more second bonding regions to which the second adhesive is bonded are located at positions that are closer to the incidence surface of the optical member than to an emission surface of the optical member.


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