The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 07, 2023

Filed:

May. 21, 2021
Applicant:

Meta Platforms Technologies, Llc, Menlo Park, CA (US);

Inventors:

Christopher Yuan Ting Liao, Seattle, WA (US);

Maik Andre Scheller, Redmond, WA (US);

Jonathan Robert Peterson, Woodinville, WA (US);

Ehsan Vadiee, Redmond, WA (US);

John Goward, Redmond, WA (US);

Anurag Tyagi, Kirkland, WA (US);

Andrew John Ouderkirk, Kirkland, WA (US);

Assignee:

Meta Platforms Technologies, LLC, Menlo Park, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2023.01); H01L 31/02 (2006.01); H01L 31/0224 (2006.01); H01L 31/04 (2014.01); H01L 31/18 (2006.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01L 31/02021 (2013.01); H01L 31/022425 (2013.01); H01L 31/04 (2013.01); H01L 31/18 (2013.01);
Abstract

A method of forming a high voltage optical transformer includes forming a via through a transparent carrier wafer, forming a conductive layer within the via, bonding a solid state lighting (SSL) package to a first side of the carrier wafer, and bonding a photovoltaic (PV) wafer to a second side of the carrier wafer opposite to the first side. The photovoltaic wafer may include an active area and a conductive area located outside of the active area that is in electrical contact with the conductive layer. The method further includes forming both an SSL contact with the solid state lighting package and a PV contact with the conductive layer on the same side of the carrier wafer.


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