The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 07, 2023
Filed:
Apr. 09, 2021
Nxp B.v., Eindhoven, NL;
Waqas Hassan Syed, Eindhoven, NL;
Cicero Silveira Vaucher, Eindhoven, NL;
Antonius Johannes Matheus de Graauw, Haelen, NL;
NXP B.V., Eindhoven, NL;
Abstract
A packaged integrated circuit (IC) includes an IC die having first and second external contacts and a package substrate. The IC die is attached to the package substrate which includes a balun in a first metal layer. The balun is connected to the first and second external contacts of the IC die and to a first external contact of the package substrate. The first and second external contacts of the IC die communicate a differential signal with the package substrate, and the first external contact of the package substrate communicates a single-ended signal corresponding to the differential signal. Alternatively, the balun is connected to an external contact of the IC die and to first and second external contacts of the package substrate, in which the external contact of the IC die communicates a single-ended signal and the first and second external contacts of the package substrate communicate a differential signal.