The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 07, 2023
Filed:
Jul. 21, 2021
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventor:
Seungmin Kim, Asan-si, KR;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01); H01L 25/065 (2023.01); H01L 23/29 (2006.01); H01L 23/18 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); H01L 23/18 (2013.01); H01L 23/295 (2013.01); H01L 25/0657 (2013.01); H01L 2223/5442 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06562 (2013.01);
Abstract
A semiconductor package includes; a chip structure including vertically stacked semiconductor chips disposed on a package substrate, a spacer disposed on an uppermost semiconductor chip among the semiconductor chips, an encapsulant covering at least part of the chip structure, and including an upper portion of the encapsulant covering at least part of the spacer, and a marking pattern visually identifiable through an opening in the upper portion of the encapsulant selectively exposing portions of the spacer.
Kim, Seungmin. (2023). Semiconductor package with marking pattern (U.S. Patent No. 11810865). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11810865
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile