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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11810845 B1

PDFFull Text
Date of Patent:
Nov. 07, 2023

Filed:

Oct. 30, 2018

Carrier, assembly comprising a substrate and a carrier, and method for producing a carrier

Applicant:

Osram Oled Gmbh, Regensburg, DE;

Inventors:

Jörg Erich Sorg, Regensburg, DE;

Konrad Wagner, Regensburg, DE;

Michael Förster, Altenthann, DE;

Josef Hirn, Schwandorf, DE;

Assignee:

OSRAM OLED GMBH, Regensburg, DE;

Attorney:

ArentFox Schiff LLP

Primary Examiner:

Shaun M Campbell

Assistant Examiner:

Aneta B Cieslewicz

Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 33/62 (2010.01); H01L 33/64 (2010.01); H01L 23/373 (2006.01); H01L 25/075 (2006.01); H01L 25/16 (2023.01); H01L 23/15 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); H01L 21/486 (2013.01); H01L 25/0753 (2013.01); H01L 25/167 (2013.01); H01L 33/62 (2013.01); H01L 33/641 (2013.01); H01L 33/642 (2013.01); H01L 23/15 (2013.01); H01L 23/373 (2013.01); H01L 23/3731 (2013.01); H01L 23/3732 (2013.01); H01L 23/3733 (2013.01); H01L 23/3736 (2013.01); H01L 23/3738 (2013.01); H01L 2224/48091 (2013.01); H01L 2933/0066 (2013.01); H01L 2933/0075 (2013.01);
Abstract

Carrier with an electrically insulating base material, electrically conductive through-connections and a thermal connection element. The through-connections and the thermal connection element are each completely surrounded by the base material in the lateral direction, the thermal connection element and the through-connections completely penetrating the base material perpendicularly to the main extension plane of the carrier, and the thermal connection element being formed with a material which has a thermal conductivity of at least 200 W/(m K).

Find Patent Forward Citations

Sorg, Jörg. (2023). Carrier, assembly comprising a substrate and a carrier, and method for producing a carrier (U.S. Patent No. 11810845). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11810845

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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