The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 07, 2023
Filed:
Apr. 13, 2021
Denso Corporation, Kariya, JP;
Hamamatsu Photonics K.k., Hamamatsu, JP;
National University Corporation Tokai National Higher Education and Research System, Nagoya, JP;
Masatake Nagaya, Kariya, JP;
Kazukuni Hara, Kariya, JP;
Daisuke Kawaguchi, Hamamatsu, JP;
Toshiki Yui, Hamamatsu, JP;
Chiaki Sasaoka, Nagoya, JP;
Jun Kojima, Nagoya, JP;
Shoichi Onda, Nagoya, JP;
DENSO CORPORATION, Kariya, JP;
HAMAMATSU PHOTONICS K.K., Hamamatsu, JP;
National University Corporation Tokai National Higher Education and Research System, Nagoya, JP;
Abstract
A semiconductor chip includes: an epitaxial film made of gallium nitride; a semiconductor element disposed in the epitaxial film; a chip formation substrate including the epitaxial film and having a first surface, a second surface opposite to the first surface, and a side surface connecting the first surface and the second surface; and a convex and a concavity on the side surface.