The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 07, 2023

Filed:

Sep. 29, 2021
Applicant:

Western Digital Technologies, Inc., San Jose, CA (US);

Inventor:

Kai Tang, San Jose, CA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/667 (2006.01); G11B 5/84 (2006.01); G11B 5/73 (2006.01);
U.S. Cl.
CPC ...
G11B 5/667 (2013.01); G11B 5/737 (2019.05); G11B 5/7379 (2019.05); G11B 5/8404 (2013.01);
Abstract

Various apparatuses, systems, methods, and media are disclosed to provide a magnetic recording medium with a tungsten (W) pre-seed layer. The W pre-seed layer has a higher conductance than a CrTi pre-seed layer with a similar thickness. In one embodiment, the W pre-seed layer is made of about 95 atomic percent or more of W. The W pre-seed layer has lower electrical resistivity than the CrTi pre-seed layer. As a result, the thickness of the W pre-seed layer can be reduced as compared to the thickness of a CrTi pre-seed layer if a similar conductance is to be achieved. The magnetic recording materials deposited on top of the W pre-seed layer with the reduced thickness provide comparable crystallographic orientation and recording performance to those deposited on top of a thicker CrTi pre-seed layer with a similar conductance.


Find Patent Forward Citations

Loading…