The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 07, 2023
Filed:
Jun. 04, 2021
Nanobit Tech. Co., Ltd., Taoyuan, TW;
Sheng-Chieh Tsai, Taoyuan, TW;
Yao-Zong Chen, Taoyuan, TW;
Yu-Yang Chang, Taoyuan, TW;
Hsiou-Ming Liu, Taoyuan, TW;
NANOBIT TECH. CO., LTD., Taoyuan, TW;
Abstract
A transparent conductive substrate structure used for a thermoforming process includes a transparent cover plate and a touch sensing layer structure. The transparent cover plate includes a toughening layer on one side thereof. The touch sensing layer structure arranged on one surface of the toughening layer, and includes a first transparent conductive layer, a dielectric layer, a barrier layer, a second transparent conductive layer, and a buffer protective layer. Each transparent conductive layer is directly applied to the transparent cover plate, so that the thickness between the transparent conductive layers is below 1 μm. The thickness between layers may be reduced to increase the sensitivity of the touch sensing layer structure. To prevent each transparent conductive layer and an electrode wire layer from breaking during the thermoforming process, the transparent conductive substrate structure is combined with the buffer protective layer to strengthen the structure of each transparent conductive layer.