The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 07, 2023

Filed:

Feb. 21, 2022
Applicant:

Epistar Corporation, Hsinchu, TW;

Inventors:

Chi-Chih Pu, Lung Tan, TW;

Chen-Hong Lee, Lung Tan, TW;

Shih-Yu Yeh, Lung Tan, TW;

Wei-Kang Cheng, Lung Tan, TW;

Shyi-Ming Pan, Lung Tan, TW;

Siang-Fu Hong, Lung Tan, TW;

Chih-Shu Huang, Lung Tan, TW;

Tzu-Hsiang Wang, Lung Tan, TW;

Shih-Chieh Tang, Lung Tan, TW;

Cheng-Kuang Yang, Lung Tan, TW;

Assignee:

EPISTAR CORPORATION, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 21/14 (2006.01); H01L 33/50 (2010.01); H01L 33/48 (2010.01); H01L 33/44 (2010.01); F21K 9/232 (2016.01); F21V 21/00 (2006.01); H01L 25/075 (2006.01); F21V 29/85 (2015.01); F21V 3/02 (2006.01); F21V 17/10 (2006.01); F21V 23/06 (2006.01); H01L 33/00 (2010.01); F21Y 107/00 (2016.01); F21Y 115/10 (2016.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
F21V 21/14 (2013.01); F21K 9/232 (2016.08); F21V 3/02 (2013.01); F21V 17/10 (2013.01); F21V 21/00 (2013.01); F21V 23/06 (2013.01); F21V 29/85 (2015.01); H01L 25/0753 (2013.01); H01L 33/44 (2013.01); H01L 33/486 (2013.01); H01L 33/50 (2013.01); H01L 33/508 (2013.01); F21Y 2107/00 (2016.08); F21Y 2115/10 (2016.08); H01L 24/14 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 33/007 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/14051 (2013.01); H01L 2224/16 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/49107 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83385 (2013.01); H01L 2224/8592 (2013.01); H01L 2924/00011 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/19107 (2013.01); H01L 2924/3025 (2013.01);
Abstract

A light emitting apparatus, including: a first light emitting device with a first substrate having a first upper surface and first bottom surface, a plurality of first LED chips disposed on the first upper surface, emitting a light penetrating the first substrate, and a first wavelength conversion layer directly contacting the plurality of first LED chips and first upper surface, and a first shape in a cross-sectional view; a second wavelength conversion layer directly contacting the first bottom surface; a second shape in the cross-sectional view substantially the same as the first shape; a second light emitting device separated from the first light emitting device, including a second substrate and plurality of second LEDs disposed on the second substrate; a support base connected to the first light emitting device by a first angle and connected to the second light emitting device by a second angle; and a first support arranged between the support base and first light emitting device.


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