The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 07, 2023

Filed:

Mar. 05, 2021
Applicant:

Ecco Sko A/s, Bredebro, DK;

Inventors:

Niki Tæstensen, Hamburg, DE;

Savino Paulo Bove, Biel, CH;

Assignee:

ECCO Sko A/S, Bredebro, DK;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
D04B 1/10 (2006.01); A43B 23/02 (2006.01); B29D 35/06 (2010.01);
U.S. Cl.
CPC ...
D04B 1/106 (2013.01); A43B 23/0215 (2013.01); A43B 23/0245 (2013.01); A43B 23/0265 (2013.01); B29D 35/061 (2013.01); B29D 35/068 (2013.01); D10B 2501/043 (2013.01);
Abstract

An upper for a shoe and a shoe including an upper and a sole that is connected to the upper may be provided. In one implementation, an upper for a shoe may be provided, the shoe including the upper and a sole connected to a lower edge of the upper via injection molding. The upper may include a first knitted area having a first stitch density, wherein a portion of the first knitted area may be located at the lower edge of the upper and may include a first meltable material having a first melting temperature. The first meltable material may be melted prior to or during the connection of the sole to the upper and may limit the flow of molding material through a melted area of the upper.


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