The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 07, 2023
Filed:
Oct. 22, 2019
Wonjinmetal Co., Ltd., Dongducheon-si, KR;
WONJINMETAL CO., LTD., Dongducheon-si, KR;
Abstract
Provided is a complex copper alloy including a high-entropy alloy and a method of manufacturing the same. The complex copper alloy includes a metal matrix including copper or a copper alloy and a high-entropy alloy (HEA) existing in a crystal grain of the metal matrix. A method of manufacturing the complex copper alloy is a method of manufacturing a complex copper alloy, which includes a metal matrix including copper or a copper alloy, and a high-entropy alloy (HEA) existing in a crystal grain of the metal matrix. The method includes preparing a raw material of the metal matrix and raw material of the high-entropy alloy and melting and alloying the raw material of the metal matrix and the raw material of the high-entropy alloy.