The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 07, 2023
Filed:
Dec. 09, 2019
Applicant:
Nippon Steel Chemical & Material Co., Ltd., Tokyo, JP;
Inventors:
Hiroshi Sato, Tokyo, JP;
Kazuo Ishihara, Tokyo, JP;
Assignee:
NIPPON STEEL CHEMICAL & MATERIAL CO., LTD., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
C08G 59/06 (2006.01); C08G 59/24 (2006.01); C08G 59/32 (2006.01); C08G 59/40 (2006.01); C08G 59/50 (2006.01); C08G 59/68 (2006.01); C08G 65/40 (2006.01); C08L 63/04 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
C08G 59/066 (2013.01); C08G 59/245 (2013.01); C08G 59/32 (2013.01); C08G 59/4021 (2013.01); C08G 59/5073 (2013.01); C08G 59/686 (2013.01); C08G 59/688 (2013.01); C08G 65/40 (2013.01); C08L 63/04 (2013.01); H05K 3/4655 (2013.01); C08L 2201/08 (2013.01); C08L 2203/20 (2013.01);
Abstract
Provided are a phenoxy resin having excellent heat resistance, low hygroscopicity, and solvent solubility, a resin composition using the same, and a cured object obtained therefrom. The phenoxy resin is represented by Formula (1) below and has an Mw of 10,000 to 200,000: where, X represents a divalent group, and includes, essentially, a group having a cyclohexane ring structure and a group having a fluorene ring structure. Y represents a hydrogen atom or a glycidyl group. n is the number of repetitions and an average value thereof is 25 to 500.