The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 07, 2023

Filed:

Oct. 25, 2018
Applicant:

Shikoku Chemicals Corporation, Kagawa, JP;

Inventors:

Naoto Okumura, Kagawa, JP;

Akihito Otsuka, Kagawa, JP;

Takeshi Kumano, Kagawa, JP;

Kazuyuki Fujikawa, Kagawa, JP;

Yusuke Araki, Kagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C07C 321/22 (2006.01); C08L 63/00 (2006.01); C09J 163/00 (2006.01); C07C 319/02 (2006.01); C07C 319/18 (2006.01); C07D 233/34 (2006.01); C07D 235/26 (2006.01); C08G 59/66 (2006.01); C07C 321/14 (2006.01); C07C 321/10 (2006.01);
U.S. Cl.
CPC ...
C07C 321/14 (2013.01); C07C 319/02 (2013.01); C07C 319/18 (2013.01); C07C 321/10 (2013.01); C07C 321/22 (2013.01); C07D 233/34 (2013.01); C07D 235/26 (2013.01); C08G 59/66 (2013.01); C08L 63/00 (2013.01); C09J 163/00 (2013.01);
Abstract

The purpose of the present invention is to provide: novel thiol compounds; a method for synthesizing said thiol compounds; curing agents containing said thiol compounds; resin compositions containing said thiol compounds and an epoxy compound; and resin compositions containing said thiol compounds and an ene compound having a carbon-carbon double bond in a molecule. Furthermore, the purpose of the present invention is to provide adhesives and sealants having these resin compositions as ingredients. The thiol compounds of the present invention are represented by chemical formula (I) to chemical formula (VII).


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