The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 07, 2023

Filed:

Jan. 24, 2022
Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventors:

Takeshi Miyato, Kanagawa, JP;

Michio Arai, Kanagawa, JP;

Yusuke Fujii, Kanagawa, JP;

Kenji Shirokane, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41M 5/00 (2006.01); B41M 7/00 (2006.01); C09D 11/322 (2014.01); C09D 11/10 (2014.01); C09D 11/30 (2014.01); G06F 17/18 (2006.01);
U.S. Cl.
CPC ...
B41M 5/0064 (2013.01); B41M 5/0023 (2013.01); B41M 7/009 (2013.01); C09D 11/322 (2013.01); B41M 5/0011 (2013.01); B41M 5/0017 (2013.01); B41M 5/0047 (2013.01); C09D 11/10 (2013.01); C09D 11/30 (2013.01); G06F 17/18 (2013.01);
Abstract

Provided is an image recording method including applying an ink containing water, a resin X, and a colorant onto a resin base material A which has a specific distortion rate and to which a tension is applied, to obtain an image, heating the image to a temperature Td and drying the image, and cooling the image to a temperature Tr, in which σcalculated by Equation (1) is 40 kgf/cmor less. E(T) represents an elastic modulus of the resin X at the temperature T, ε(T) represents an expansion coefficient of the resin base material A under specific conditions, E(T) represents an elastic modulus of the resin X at a temperature T of the image in the cooling, α(T) represents a linear expansion coefficient of the resin X at the temperature T, and α(T) represents a linear expansion coefficient of the resin base material A under specific conditions.σ=|σ+σ|  Equation (1)σ()ε()  Equation (2)σ=∫()(α()−α())  Equation (3)


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